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Dupont/Site web/09/21/13
Foaming fluoroplastic resin insulation reduces its dielectric constant, providing opportunities for miniaturization and weight savings because lower insulation wall thickness can be used. In addition, because this reduces dissipation factor the resulting insulated wire has lower capacitance and attenuation. Foamed insulation also increases the relative velocity of data transmission over insulated wire.
léger, isolant thermique et électrique, poreux
materiau, énergie, électronique
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